TechConnect World Innovation Conference 

Gaylord National Convention Center
Washington DC, June 14-17

Connect – Academic & Industry Research

Connect – with Corporate Prospectors

Connect – with Federal Agencies

How to Participate

>> Submit Technical Abstract
Review & Publication – due Feb. 27th

>> Submit Innovation
IP,

SBIR, Early-Stage – due Feb. 13^th

Key Speakers Include:

• Brian L Wardle, MIT, US
• Limeng Chen, Cabot Corporation, US
• Shu-Jen Han, IBM, US
• Loon-Seng Tan, U.S. Air Force, US
• Dorothee Martin, Saint-Gobain, US
• Mark Minnichelli, BASF, US
• Michael Pambianchi, Corning, US
• Paul Vogt, Momentive, US
• Larry Mann, Shoei Electronic Materials, US
• Kikuo Okuyama, Hiroshima Univ., JP
• Mansoo Choi, Seoul National Univ., KR
• Wendelin Stark , ETH Zurich, CH
• Eric W. Nelson, 3M, US
• Thomas Scheibel, Univ. of Bayreuth, DE
• Liangliang Cao, Whirlpool Corporation, US
• Curtis Marcott, Light Light Solutions, US
• Mike Radler, Dow Chemical, US
• Ming Huang, Corning, US
• Atsushi Hozumi, National Inst. of Advanced Industrial Science & Tech., JP

• Luigi Calzolai, European Joint Research Centre (JRC), Italy
• Quoc Truong, U.S. Army Natick Soldier 

• Peter Hosemann, UC Berkeley, US
• David C. Bell, Harvard, US
• Patrice Gergaud, CEA-LETI, FR
• Gordon A. Shaw III, NIST, US
• Valeriy V. Ginzburg, Dow Chemical, US
• Tsu-Wei Chou, University Delaware, US
• Allen Clauss, Xolve, US
• Mark Hersam, Northwestern University, US
• Michael Z. Hu, Oak Ridge National Lab, US
• Eugene Pashkovski, The Lubrizol Corp., US
• Kostya Ostrikov, CSIRO, Australia
• Kazuhiro Takanabe, King Abdullah Univ., SA
• Slade Gardner, Lockheed Martin, US
• David Green, BASF Corporation, US
• Joe Fox, Ashland Inc., US
• Antoine Fécant, IFP Energies nouvelles, FR
• Stefan Seeger, University of Zurich, CH
• Tim Atherton, Tufts University, US
• Kendra Erk, Purdue University, US
• Michael P. Krein, Lockheed Martin, US